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dc.contributor.authorWei Wang
dc.contributor.authorHongseok Noh
dc.contributor.authorPeter J. Hesketh
dc.contributor.authorYong Huang
dc.contributor.authorNicole Coutris
dc.date.accessioned2017-05-09T00:37:16Z
dc.date.available2017-05-09T00:37:16Z
dc.date.copyrightMarch, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26302#014501_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142975
dc.description.abstractThe transverse shear effect has been frequently ignored in determining the debonding-related energy release rate and the phase angle in the blister test, resulting in underestimated values. This study aims to study the effect of shear force on the energy release rate and phase angle prediction in the blister test. A generalized approach is proposed to predict them under the effect of shear force. The predictions show that when the ratio of the film thickness to the debonded film window radius is large (such as 0.05), the transverse shear effect cannot be ignored in determining the energy release rate and the phase angle. The study also further illustrates the importance of including the shear force contribution in estimation and how this importance depends on the film thickness to debonded radius ratio, as well as the elastic mismatch.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleEvaluation of Transverse Shear Effect on Film Delamination in Blister Test
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4000717
dc.journal.fristpage14501
dc.identifier.eissn1043-7398
dc.keywordsForce
dc.keywordsShear (Mechanics)
dc.keywordsFilm thickness
dc.keywordsStress AND Delamination
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 001
dc.contenttypeFulltext


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