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dc.contributor.authorV. Székely
dc.contributor.authorE. Kollár
dc.contributor.authorG. Somlay
dc.contributor.authorP. G. Szabó
dc.contributor.authorM. Rencz
dc.date.accessioned2017-05-09T00:37:15Z
dc.date.available2017-05-09T00:37:15Z
dc.date.copyrightMarch, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26302#011001_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142967
dc.description.abstractTesting the thermal properties of thermal interface material (TIM) has been a big challenge for decades. Recent development trends made this challenge even bigger, as now the values that have to be measured are extremely small. In this paper, we present a newly developed TIM tester equipment that is targeting to overcome all the problems that present industrial TIM testing methods face. The main idea behind our design is to use the capabilities of microelectronics in order to make small sized sensors both for temperature and heat-flux sensings. This way it is possible to place these sensors in the closest proximity of the measured sample. This paper presents details of all the technical solutions of the newly developed static TIM tester that is capable to measure Rth of unit area values in the order of 0.01 K cm2/W with good accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDesign of a Static TIM Tester
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4000715
dc.journal.fristpage11001
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 001
dc.contenttypeFulltext


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