Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

Abstract

Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal management of three-dimensional integrated circuits (3D-ICs) leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly nonuniform and nonunidirectional due to many factors such as power architectures, transistors packing density, and real estate available on the chip. In this study, the development of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13°C utilizing a multidimensional configured thermoelectric will be presented.