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dc.contributor.authorVarghese Panthalookaran
dc.date.accessioned2017-05-09T00:37:13Z
dc.date.available2017-05-09T00:37:13Z
dc.date.copyrightSeptember, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26306#031007_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142949
dc.description.abstractNatural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires enhancement. Chimneylike flows developed within the cabinets of electronic devices can provide better mass flow and heat transfer rates and can lead to greater cooling efficiency. Constraints in the design of natural convection cooling systems include efficiency of packing, aesthetics, and concerns of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation on natural convection cooling within such design constraints. Insights thus derived are found useful for designing an energy-efficient and ecofriendly cooling system for electronic devices.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleCFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4002009
dc.journal.fristpage31007
dc.identifier.eissn1043-7398
dc.keywordsFlow (Dynamics)
dc.keywordsHeat
dc.keywordsEnergy dissipation
dc.keywordsTemperature
dc.keywordsCooling
dc.keywordsNatural convection
dc.keywordsComputational fluid dynamics
dc.keywordsSeparation (Technology)
dc.keywordsMetal–oxide–semiconductor field-effect transistors AND Design
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003
dc.contenttypeFulltext


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