| dc.contributor.author | Clemens J. M. Lasance | |
| dc.date.accessioned | 2017-05-09T00:37:12Z | |
| dc.date.available | 2017-05-09T00:37:12Z | |
| dc.date.copyright | September, 2010 | |
| dc.date.issued | 2010 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26306#031004_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/142944 | |
| dc.description.abstract | The nontrivial issues associated with calculating the steady state heat spreading effects generated by a heat source on top of a multilayer assembly such as a printed circuit board are discussed. It is argued that problems arise with the interpretation of heat spreading effects due to a misconception about the meaning of often-quoted flux limits and especially the physical meaning of thermal resistance. The usefulness of a number of approaches that are generally in use to analyze heat spreading effects is discussed and it is shown that the popular series-resistance approach has severe limitations. A number of test cases are covered in detail and the results testify to this assertion. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | How to Estimate Heat Spreading Effects in Practice | |
| dc.type | Journal Paper | |
| dc.journal.volume | 132 | |
| dc.journal.issue | 3 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4001856 | |
| dc.journal.fristpage | 31004 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Heat | |
| dc.keywords | Equations | |
| dc.keywords | Stereolithography | |
| dc.keywords | Thickness | |
| dc.keywords | Electrical resistance | |
| dc.keywords | Temperature | |
| dc.keywords | Thermal resistance AND Thermal conductivity | |
| dc.tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003 | |
| dc.contenttype | Fulltext | |
