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dc.contributor.authorDavid Newport
dc.contributor.authorColin Forno
dc.contributor.authorMaurice Whelan
dc.date.accessioned2017-05-09T00:37:12Z
dc.date.available2017-05-09T00:37:12Z
dc.date.copyrightSeptember, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26306#031001_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142941
dc.description.abstractOptical noninvasive temperature measurement techniques, such as interferometry, are particularly advantageous in obtaining temperature information noninvasively from enclosed low velocity flows induced by thermal sources, as commonly arise in electronic systems. The single greatest restriction in the application of interferometry as a standard measurement methodology has been the enormous cost associated with the optical equipment required. This cost is due to the quality of the optics required, which exhibits an exponential dependence on size. Digital Moiré subtraction is a technique, which removes the restriction on the use of high quality optics, thereby, enabling reasonably large fields of view. In this paper, a digital Moiré subtraction interferometer configuration is presented with a 140 mm field of view. First, the ability of the interferometer to accurately measure the free convection temperature field about an isothermal horizontal cylinder is examined through a comparison with measurements from literature using classical interferometry. The technique is then applied to the thermal interaction between 2D components representing BGAs mounted on a vertical printed circuit board (PCB). Qualitative and quantitative evaluation of the interferograms show the significant influence of in-plane PCB conductivity on the temperature field about the PCB. The spacing to length ratio above, which upstream components on a PCB experience enhanced cooling, is reduced from 4 to 3 for a PCB with a high effective in-plane conductivity (15 W/m K).
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDigital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4002161
dc.journal.fristpage31001
dc.identifier.eissn1043-7398
dc.keywordsFlow (Dynamics)
dc.keywordsTemperature
dc.keywordsInterferometry
dc.keywordsInterferometers
dc.keywordsCylinders
dc.keywordsConductivity
dc.keywordsMeasurement
dc.keywordsNatural convection
dc.keywordsComputer cooling AND Cooling
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003
dc.contenttypeFulltext


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