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dc.contributor.authorPeng Cheng
dc.contributor.authorScott Thompson
dc.contributor.authorJoe Boswell
dc.contributor.authorH. B. Ma
dc.date.accessioned2017-05-09T00:37:11Z
dc.date.available2017-05-09T00:37:11Z
dc.date.copyrightDecember, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26309#041009_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142931
dc.description.abstractThe heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of a copper plate in order to increase the channel number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power input and operating temperature. The FP-OHP charged with 0.0003 vol % gold/water nanofluids achieved a thermal resistance of 0.078 K/W while removing 560 W with a heat flux of 86.8 W/cm2. The thermal resistance was further decreased when the nanofluid was used as the working fluid. A mathematical model predicting the heat transfer performance was developed to predict the thermal performance of the FP-OHP. Results presented here will assist in the optimization of the FP-OHP and provide a better understanding of heat transfer mechanisms occurring in OHPs.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAn Investigation of Flat-Plate Oscillating Heat Pipes
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4002726
dc.journal.fristpage41009
dc.identifier.eissn1043-7398
dc.keywordsHeat pipes
dc.keywordsCondensers (steam plant)
dc.keywordsDiamonds
dc.keywordsFlat plates
dc.keywordsNanofluids
dc.keywordsThermal resistance
dc.keywordsWater
dc.keywordsGravity (Force)
dc.keywordsTemperature
dc.keywordsHeat transfer
dc.keywordsCooling
dc.keywordsFluids
dc.keywordsChannels (Hydraulic engineering)
dc.keywordsOperating temperature
dc.keywordsCopper
dc.keywordsHeating
dc.keywordsMotion AND Heat flux
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
dc.contenttypeFulltext


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