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dc.contributor.authorM. Mastrangeli
dc.contributor.authorK. Jans
dc.contributor.authorC. Van Hoof
dc.contributor.authorJ.-P. Celis
dc.contributor.authorT. Steylaerts
dc.date.accessioned2017-05-09T00:37:11Z
dc.date.available2017-05-09T00:37:11Z
dc.date.copyrightDecember, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26309#041008_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142930
dc.description.abstractSelective chemical preconditioning of geometrically patterned substrates and parts is necessary to enable capillary part-to-substrate self-assembly. On the other hand, long preparation procedures may preclude the throughput enhancement potentially brought by the technique. In this paper, we investigate the fast chemical preconditioning of patterned substrates by the chemisorption of thiolates from the liquid phase. We found that even under conservative conditions, deposition times as short as 15 s (i.e., about two orders of magnitude shorter than previously reported in specific literature) are sufficient for the intended purpose, which is changing the wetting character of metallic binding sites enough to allow their selective dip-coating with hydrophobic fluid lenses. Moreover, perfect fluid coating conformality is achieved when such short deposition times are combined with the use of recessed binding sites. Our findings further confirm organic species to be remarkable tools for the chemical preconditioning of patterned surfaces as they may help actualize the full benefits of capillary self-assembly for electronic packaging.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleFast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4002725
dc.journal.fristpage41008
dc.identifier.eissn1043-7398
dc.keywordsFluids
dc.keywordsCoating processes
dc.keywordsCoatings
dc.keywordsSelf-assembly
dc.keywordsMeasurement
dc.keywordsElectronic packaging AND Wetting (Surface science)
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
dc.contenttypeFulltext


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