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dc.contributor.authorE. Suhir
dc.date.accessioned2017-05-09T00:36:04Z
dc.date.available2017-05-09T00:36:04Z
dc.date.copyrightSeptember, 2010
dc.date.issued2010
dc.identifier.issn0003-6900
dc.identifier.otherAMREAD-25935#050803_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142326
dc.description.abstractThe published work on analytical (“mathematical”) and computer-aided, primarily finite-element-analysis based, predictive modeling of the dynamic response of electronic systems to shocks and vibrations is reviewed. Understanding the physics and the ability to predict the response of an electronic structure to dynamic loading has been always of significant importance in military, avionic, aeronautic, automotive, and maritime electronics. For the past decade, this problem has become important also in commercial, and, particularly, in portable, electronics in connection with accelerated testing on the board level of various surface-mount technology systems. The emphasis of this review is on the nonlinear behavior of flexible printed circuit boards experiencing shock loading applied to their support contours.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titlePredictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations
dc.typeJournal Paper
dc.journal.volume63
dc.journal.issue5
dc.journal.titleApplied Mechanics Reviews
dc.identifier.doi10.1115/1.4003712
dc.journal.fristpage50803
dc.identifier.eissn0003-6900
dc.keywordsStress
dc.keywordsShock (Mechanics)
dc.keywordsModeling
dc.keywordsVibration
dc.keywordsDynamic response
dc.keywordsElectronic systems
dc.keywordsElectronics
dc.keywordsFinite element analysis AND Testing
dc.treeApplied Mechanics Reviews:;2010:;volume( 063 ):;issue: 005
dc.contenttypeFulltext


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