| dc.contributor.author | G. De Mey | |
| dc.contributor.author | M. Wójcik | |
| dc.contributor.author | J. Banaszczyk | |
| dc.contributor.author | A. Napieralski | |
| dc.contributor.author | M. De Paepe | |
| dc.contributor.author | B. Vermeersch | |
| dc.contributor.author | J. Pilarski | |
| dc.contributor.author | M. Lasota | |
| dc.date.accessioned | 2017-05-09T00:32:23Z | |
| dc.date.available | 2017-05-09T00:32:23Z | |
| dc.date.copyright | March, 2009 | |
| dc.date.issued | 2009 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26292#014501_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/140335 | |
| dc.description.abstract | The thermal impedance Zth(jω) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection cooling. From the thermal impedance Zth(jω) the influence of the chimney on the reduction in thermal resistance Rth=Zth(jω=0) is clearly visible. A maximum improvement of almost 20% has been observed experimentally. Measuring the thermal impedance as a function of the angular frequency ω provides specific information about the thermal path being influenced by the chimney. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin | |
| dc.type | Journal Paper | |
| dc.journal.volume | 131 | |
| dc.journal.issue | 1 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.3068307 | |
| dc.journal.fristpage | 14501 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Cooling | |
| dc.keywords | Impedance (Electricity) | |
| dc.keywords | Natural convection | |
| dc.keywords | Transistors | |
| dc.keywords | Thermal resistance AND Junctions | |
| dc.tree | Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001 | |
| dc.contenttype | Fulltext | |
