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dc.contributor.authorYen-Shu Chen
dc.contributor.authorKuo-Hsiang Chien
dc.contributor.authorYung-Shin Tseng
dc.contributor.authorYea-Kuang Chan
dc.date.accessioned2017-05-09T00:32:21Z
dc.date.available2017-05-09T00:32:21Z
dc.date.copyrightMarch, 2009
dc.date.issued2009
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26292#011004_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/140320
dc.description.abstractThis study presents an approximation for determining an optimized thickness of a concentric heated rectangular plate and derives an analytical solution for spreading resistance of a spreader having orthotropic conductivities. The solution for the orthotropic plate is obtained by separation of variables, and the optimized thickness is determined by taking the derivative of the thermal resistance with respect to the spreader thickness. According to the calculated results, an enhanced in-plane spreading effect can reduce the spreading resistance. The spreading resistance dominates the overall resistance of thin plates, whereas the one-dimensional conduction resistance becomes important for thick plates. However, the predicted optimized thickness from the approximation shows a disparity from the analytical results, while the aspect ratio between a spreader and heat source is less than 0.2. Even so, the thermal resistance corresponding to the predicted thickness is still in good agreement with the analytical solution. The proposed approximation will be useful for practical thermal design of heat sinks by predetermining the spreader thickness.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDetermination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance
dc.typeJournal Paper
dc.journal.volume131
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3068299
dc.journal.fristpage11004
dc.identifier.eissn1043-7398
dc.keywordsElectrical resistance
dc.keywordsApproximation
dc.keywordsThickness
dc.keywordsHeat AND Thermal resistance
dc.treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001
dc.contenttypeFulltext


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