Show simple item record

dc.contributor.authorMadhusudan Iyengar
dc.contributor.authorRoger Schmidt
dc.date.accessioned2017-05-09T00:32:19Z
dc.date.available2017-05-09T00:32:19Z
dc.date.copyrightJune, 2009
dc.date.issued2009
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26295#021009_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/140308
dc.description.abstractThe increasingly ubiquitous nature of computer and internet usage in our society has driven advances in semiconductor technology, server packaging, and cluster level optimizations in the IT industry. Not surprisingly this has an impact on our societal infrastructure with respect to providing the requisite energy to fuel these power hungry machines. Cooling has been found to contribute about a third of the total data center energy consumption and is the focus of this study. In this paper we develop and present physics based models to allow the prediction of the energy consumption and heat transfer phenomenon in a data center. These models allow the estimation of the microprocessor junction and server inlet air temperatures for different flows and temperature conditions at various parts of the data center cooling infrastructure. For the case study example considered, the chiller energy use was the biggest fraction of about 41% and was also the most inefficient. The room air conditioning was the second largest energy component and was also the second most inefficient. A sensitivity analysis of plant and chiller energy efficiencies with chiller set point temperature and outdoor air conditions is also presented.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAnalytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
dc.typeJournal Paper
dc.journal.volume131
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3103952
dc.journal.fristpage21009
dc.identifier.eissn1043-7398
dc.keywordsFlow (Dynamics)
dc.keywordsHeat
dc.keywordsTemperature
dc.keywordsCooling
dc.keywordsData centers
dc.keywordsEnergy consumption
dc.keywordsIndustrial plants
dc.keywordsWater
dc.keywordsCoolants
dc.keywordsCooling towers
dc.keywordsStress AND Heat transfer
dc.treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
dc.contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record