| dc.contributor.author | T. L. Bergman | |
| dc.date.accessioned | 2017-05-09T00:32:19Z | |
| dc.date.available | 2017-05-09T00:32:19Z | |
| dc.date.copyright | June, 2009 | |
| dc.date.issued | 2009 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26295#021008_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/140307 | |
| dc.description.abstract | Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε-NTU heat exchanger methodology, and is used to examine enhancement associated with use of H2O–Al2O3 nanofluids in a heat sink experiencing turbulent flow. Predictive correlations are generated to ascertain the degree of enhancement based on the fluid’s thermophysical properties. The enhancement is quite small, suggesting the limited usefulness of nanofluids in this particular application. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H2O–Al2O3 Nanofluids | |
| dc.type | Journal Paper | |
| dc.journal.volume | 131 | |
| dc.journal.issue | 2 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.3103949 | |
| dc.journal.fristpage | 21008 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Heat transfer | |
| dc.keywords | Turbulence | |
| dc.keywords | Heat sinks | |
| dc.keywords | Nanofluids | |
| dc.keywords | Fluids AND Coolants | |
| dc.tree | Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002 | |
| dc.contenttype | Fulltext | |