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dc.contributor.authorAfzal Husain
dc.contributor.authorKwang-Yong Kim
dc.date.accessioned2017-05-09T00:32:19Z
dc.date.available2017-05-09T00:32:19Z
dc.date.copyrightJune, 2009
dc.date.issued2009
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26295#021005_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/140304
dc.description.abstractA microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
dc.typeJournal Paper
dc.journal.volume131
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3103931
dc.journal.fristpage21005
dc.identifier.eissn1043-7398
dc.keywordsDesign
dc.keywordsOptimization
dc.keywordsHeat sinks
dc.keywordsThermal resistance
dc.keywordsMicrochannels
dc.keywordsShapes
dc.keywordsFlow (Dynamics)
dc.keywordsHeat transfer
dc.keywordsResponse surface methodology AND Polynomials
dc.treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
dc.contenttypeFulltext


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