| dc.contributor.author | Ken-ichi Ohguchi | |
| dc.contributor.author | Katsuhiko Sasaki | |
| dc.contributor.author | Setsuo Aso | |
| dc.date.accessioned | 2017-05-09T00:32:19Z | |
| dc.date.available | 2017-05-09T00:32:19Z | |
| dc.date.copyright | June, 2009 | |
| dc.date.issued | 2009 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26295#021003_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/140302 | |
| dc.description.abstract | This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test | |
| dc.type | Journal Paper | |
| dc.journal.volume | 131 | |
| dc.journal.issue | 2 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.3103951 | |
| dc.journal.fristpage | 21003 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Creep | |
| dc.keywords | Stress | |
| dc.keywords | Waves | |
| dc.keywords | Stress-strain relations | |
| dc.keywords | Lead-free solders | |
| dc.keywords | Deformation | |
| dc.keywords | Engineering simulation | |
| dc.keywords | Solders | |
| dc.keywords | Constitutive equations | |
| dc.keywords | Relaxation (Physics) AND Alloys | |
| dc.tree | Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002 | |
| dc.contenttype | Fulltext | |