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dc.contributor.authorKen-ichi Ohguchi
dc.contributor.authorKatsuhiko Sasaki
dc.contributor.authorSetsuo Aso
dc.date.accessioned2017-05-09T00:32:19Z
dc.date.available2017-05-09T00:32:19Z
dc.date.copyrightJune, 2009
dc.date.issued2009
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26295#021003_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/140302
dc.description.abstractThis paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleEvaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
dc.typeJournal Paper
dc.journal.volume131
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3103951
dc.journal.fristpage21003
dc.identifier.eissn1043-7398
dc.keywordsCreep
dc.keywordsStress
dc.keywordsWaves
dc.keywordsStress-strain relations
dc.keywordsLead-free solders
dc.keywordsDeformation
dc.keywordsEngineering simulation
dc.keywordsSolders
dc.keywordsConstitutive equations
dc.keywordsRelaxation (Physics) AND Alloys
dc.treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
dc.contenttypeFulltext


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