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dc.contributor.authorChristopher T. DeGroot
dc.contributor.authorAnthony G. Straatman
dc.contributor.authorLee J. Betchen
dc.date.accessioned2017-05-09T00:32:18Z
dc.date.available2017-05-09T00:32:18Z
dc.date.copyrightJune, 2009
dc.date.issued2009
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26295#021001_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/140299
dc.description.abstractA numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves for the flow and heat transfer in conjugate fluid/porous/solid domains. The results indicate that using unfinned blocks of porous aluminum results in low convective heat transfer due to the relatively low effective thermal conductivity of the porous aluminum. The addition of aluminum fins to the heat sink significantly enhances the heat transfer with only a moderate pressure drop penalty. The convective enhancement is maximized when thermal boundary layers between adjacent fins merge together and become nearly developed for much of the length of the heat sink. It is found that the heat transfer enhancement is due to increased heat entrainment into the aluminum foam by conduction. A model for the equivalent conductivity of the finned/foam heat sinks is developed using extended surface theory. This model is used to explain the heat transfer enhancement as an increase in equivalent conductivity of the device. The model is also shown to predict the heat transfer for various heat sink geometries based on a single CFD calculation to find the equivalent conductivity of the device. This model will find utility in characterizing heat sinks and in allowing for quick assessments of the effect of varying heat sink properties.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleModeling Forced Convection in Finned Metal Foam Heat Sinks
dc.typeJournal Paper
dc.journal.volume131
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3103934
dc.journal.fristpage21001
dc.identifier.eissn1043-7398
dc.keywordsHeat transfer
dc.keywordsFluids
dc.keywordsAluminum
dc.keywordsFlow (Dynamics)
dc.keywordsConductivity
dc.keywordsFins
dc.keywordsHeat sinks
dc.keywordsComputational fluid dynamics
dc.keywordsMetal foams
dc.keywordsForced convection
dc.keywordsHeat
dc.keywordsModeling AND Equations
dc.treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
dc.contenttypeFulltext


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