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dc.contributor.authorJaeseon Lee
dc.contributor.authorIssam Mudawar
dc.date.accessioned2017-05-09T00:32:17Z
dc.date.available2017-05-09T00:32:17Z
dc.date.copyrightSeptember, 2009
dc.date.issued2009
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26298#031008_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/140287
dc.description.abstractThis study examines the pressure drop characteristics of subcooled two-phase microchannel heat sinks. A new model is proposed, which depicts the subcooled flow as consisting of a homogeneous two-phase flow layer near the heated walls of the microchannel and a second subcooled bulk liquid layer. This model is intended for conditions where subcooled flow boiling persists along the entire microchannel and the outlet fluid never reaches bulk saturation temperature. Mass, momentum, and energy control volume conservation equations are combined to predict flow characteristics for thermodynamic equilibrium qualities below zero. By incorporating a relation for apparent quality across the two-phase layer and a new criterion for bubble departure, this model enables the determination of axial variations in two-phase layer thickness and velocity as well as pressure drop. The model predictions are compared with HFE 7100 pressure drop data for four different microchannel sizes with hydraulic diameters of 176–416 μm, mass velocities of 670–5550 kg/m2 s, and inlet temperatures of 0°C and −30°C. The pressure drop database is predicted with a mean absolute error of 14.9%.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleExperimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks
dc.typeJournal Paper
dc.journal.volume131
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3144146
dc.journal.fristpage31008
dc.identifier.eissn1043-7398
dc.keywordsFlow (Dynamics)
dc.keywordsBoiling
dc.keywordsPressure drop
dc.keywordsSubcooling
dc.keywordsMicrochannels
dc.keywordsHeat sinks
dc.keywordsEquations AND Temperature
dc.treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003
dc.contenttypeFulltext


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