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dc.contributor.authorBahgat Sammakia
dc.contributor.authorMohamed-Nabil Sabry
dc.date.accessioned2017-05-09T00:27:39Z
dc.date.available2017-05-09T00:27:39Z
dc.date.copyrightDecember, 2008
dc.date.issued2008
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26289#040201_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/137792
dc.description.abstractThis issue of the Journal of Electronic Packaging has eight papers selected from the first international conference on thermal issues in emerging technologies theory and applications (ThETA I) held in Cairo, Egypt, January 3–6, 2007. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains, including microelectronics, nanotechnology, smart materials, micro-electro-mechanical systems, and biomedical engineering. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA I conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The eight papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA I executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleEditorial
dc.typeJournal Paper
dc.journal.volume130
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3039759
dc.journal.fristpage40201
dc.identifier.eissn1043-7398
dc.keywordsPhysics
dc.keywordsTemperature
dc.keywordsHeat transfer
dc.keywordsCooling
dc.keywordsWorkshops (Work spaces)
dc.keywordsReliability
dc.keywordsElectronic packaging
dc.keywordsSimulation
dc.keywordsSmart materials
dc.keywordsBiomedical engineering
dc.keywordsEngineering teachers
dc.keywordsMicroelectromechanical systems
dc.keywordsExperimental methods
dc.keywordsFuel cells
dc.keywordsMechatronics
dc.keywordsModeling
dc.keywordsNanotechnology
dc.keywordsOptimization
dc.keywordsRefrigeration
dc.keywordsTwo-phase flow
dc.keywordsComputers
dc.keywordsData centers
dc.keywordsElectronic systems
dc.keywordsJapan Society of Mechanical Engineers
dc.keywordsThermal management
dc.keywordsMicroelectronic devices
dc.keywordsElectronics AND Micro gas turbines
dc.treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
dc.contenttypeFulltext


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