| dc.contributor.author | Changsoo Jang | |
| dc.contributor.author | Bongtae Han | |
| dc.contributor.author | Samson Yoon | |
| dc.contributor.author | Seungbae Park | |
| dc.date.accessioned | 2017-05-09T00:27:37Z | |
| dc.date.available | 2017-05-09T00:27:37Z | |
| dc.date.copyright | March, 2008 | |
| dc.date.issued | 2008 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26283#011004_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/137782 | |
| dc.description.abstract | We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique hygroscopic behavior of polymeric materials used in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study corroborate that the advanced scheme can be used effectively for package assemblies subjected to general anisothermal loading conditions. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem | |
| dc.type | Journal Paper | |
| dc.journal.volume | 130 | |
| dc.journal.issue | 1 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.2837521 | |
| dc.journal.fristpage | 11004 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Temperature AND Diffusion (Physics) | |
| dc.tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 001 | |
| dc.contenttype | Fulltext | |
