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dc.contributor.authorRaathai Molian
dc.contributor.authorPranav Shrotriya
dc.contributor.authorPal Molian
dc.date.accessioned2017-05-09T00:27:36Z
dc.date.available2017-05-09T00:27:36Z
dc.date.copyrightJune, 2008
dc.date.issued2008
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26285#024501_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/137776
dc.description.abstractThe traditional “evaporation∕melt and blow” mechanism of CO2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum, and uncontrolled thermal cracking. In order to overcome these limitations, a thermochemical method that uses a defocused laser beam to melt a thin layer of AlN surface in oxygen environment was utilized. Subsequent solidification of the melt layer generated shrinkage and thermal gradient stresses that, in turn, created a crack along the middle path of laser beam and caused material separation through unstable crack propagation. The benefits associated with thermal stress fracture method over the traditional method are improved cut quality, higher cutting speed, and lower energy losses.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleImproved Method of CO2 Laser Cutting of Aluminum Nitride
dc.typeJournal Paper
dc.journal.volume130
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2912223
dc.journal.fristpage24501
dc.identifier.eissn1043-7398
dc.keywordsAluminum
dc.keywordsThermal stresses
dc.keywordsLaser cutting
dc.keywordsFracture (Process)
dc.keywordsCutting
dc.keywordsOxygen
dc.keywordsStress
dc.keywordsMechanisms
dc.keywordsEnergy dissipation AND Thermal conductivity
dc.treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002
dc.contenttypeFulltext


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