| dc.contributor.author | Cheng Lin | |
| dc.contributor.author | Fangang Tseng | |
| dc.contributor.author | Ching-Chang Chieng | |
| dc.date.accessioned | 2017-05-09T00:27:35Z | |
| dc.date.available | 2017-05-09T00:27:35Z | |
| dc.date.copyright | June, 2008 | |
| dc.date.issued | 2008 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26285#021005_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/137769 | |
| dc.description.abstract | Conventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly (FSA) approach employs a lubricant fluid carrying micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise handling of microscale parts with square (few are in rectangular) shapes. The microparts fabricated from silicon-oxide wafers and ranging in size from 350×350×170μm3to1000×1000×440μm3 aligned and filled to designated sites in the substrate under water. The effects of micropart sizes and lubricants on the FSA processes are compared. This study provides a fundamental analysis for achieving and optimizing the self-alignment. The polymer or solder adhesion force of the square-patterned micropart immobilized at the larger binding sites were estimated to be 117±15μN and 510±50μN, respectively, which results in higher assembly yield of up to 100% for these samples. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect | |
| dc.type | Journal Paper | |
| dc.journal.volume | 130 | |
| dc.journal.issue | 2 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.2912216 | |
| dc.journal.fristpage | 21005 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Force | |
| dc.keywords | Adhesives | |
| dc.keywords | Lubricants | |
| dc.keywords | Self-assembly | |
| dc.keywords | Water | |
| dc.keywords | Solders AND Manufacturing | |
| dc.tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002 | |
| dc.contenttype | Fulltext | |