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dc.contributor.authorFadi Alsaleem
dc.contributor.authorMohammad I. Younis
dc.contributor.authorRonald Miles
dc.date.accessioned2017-05-09T00:27:33Z
dc.date.available2017-05-09T00:27:33Z
dc.date.copyrightSeptember, 2008
dc.date.issued2008
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26287#031002_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/137750
dc.description.abstractWe present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB and the microstructure, which can be a beam or a plate. The mechanical shock is represented as a single point force impacting the PCB. The effects of the fundamental natural frequency of the PCB, damping, shock pulse duration, electrostatic force, and their interactions are investigated. It is found that neglecting the PCB effect on the modeling of MEMS under shock loads can lead to erroneous predictions of the microstructure motion. Further, contradictory to what is mentioned in literature that a PCB, as a worst-case scenario, transfers the shock pulse to the microstructure without significantly altering its shape or intensity, we show that a poor design of the PCB or the MEMS package may result in severe amplification of the shock effect. This amplification can cause early pull-in instability for MEMS devices employing electrostatic forces.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAn Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
dc.typeJournal Paper
dc.journal.volume130
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2957319
dc.journal.fristpage31002
dc.identifier.eissn1043-7398
dc.keywordsStress
dc.keywordsShock (Mechanics)
dc.keywordsMicroelectromechanical systems
dc.keywordsMotion
dc.keywordsForce AND Manufacturing
dc.treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003
dc.contenttypeFulltext


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