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dc.contributor.authorKarl J. Geisler
dc.contributor.authorAvram Bar-Cohen
dc.date.accessioned2017-05-09T00:27:31Z
dc.date.available2017-05-09T00:27:31Z
dc.date.copyrightDecember, 2008
dc.date.issued2008
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26289#041002_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/137733
dc.description.abstractA finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit dependence of fin spacing on boiling heat transfer coefficients and on the critical heat flux (CHF). Polished silicon heat sinks are shown to dissipate at nearly five times the CHF limit of the unfinned base area and outperform comparable aluminum heat sinks by a factor of 2. For optimum heat sink geometries, over the parameter ranges explored, the fin thickness is found to be approximately equal to the fin spacing, and the relationship between the optimum thickness and spacing is demonstrated to be relatively insensitive to the fin thermal conductivity. Results suggest that even greater performance enhancements may be gained with appropriately-selected advanced materials.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleOptimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
dc.typeJournal Paper
dc.journal.volume130
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2993135
dc.journal.fristpage41002
dc.identifier.eissn1043-7398
dc.keywordsHeat
dc.keywordsAluminum
dc.keywordsBoiling
dc.keywordsHeat sinks
dc.keywordsFins
dc.keywordsThermal conductivity
dc.keywordsSilicon
dc.keywordsCritical heat flux
dc.keywordsEnergy dissipation
dc.keywordsHeat transfer coefficients AND Thickness
dc.treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
dc.contenttypeFulltext


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