| dc.contributor.author | Chang-Lin Yeh | |
| dc.contributor.author | Yi-Shao Lai | |
| dc.date.accessioned | 2017-05-09T00:23:28Z | |
| dc.date.available | 2017-05-09T00:23:28Z | |
| dc.date.copyright | March, 2007 | |
| dc.date.issued | 2007 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26272#98_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/135593 | |
| dc.description.abstract | The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles, the ball impact test process is analyzed to provide insights into transient characteristics of this particular test methodology. A design guideline for the ball impact test apparatus based on characteristics of the measured impact force profile is proposed. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Design Guideline for Ball Impact Test Apparatus | |
| dc.type | Journal Paper | |
| dc.journal.volume | 129 | |
| dc.journal.issue | 1 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.2429716 | |
| dc.journal.fristpage | 98 | |
| dc.journal.lastpage | 104 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Force | |
| dc.keywords | Design | |
| dc.keywords | Solder joints | |
| dc.keywords | Impact testing | |
| dc.keywords | Fracture (Process) | |
| dc.keywords | Damping | |
| dc.keywords | Brittleness AND Drops | |
| dc.tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001 | |
| dc.contenttype | Fulltext | |
