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dc.contributor.authorJ. Richard Culham
dc.contributor.authorWaqar A. Khan
dc.contributor.authorM. Michael Yovanovich
dc.contributor.authorYuri S. Muzychka
dc.date.accessioned2017-05-09T00:23:28Z
dc.date.available2017-05-09T00:23:28Z
dc.date.copyrightMarch, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26272#76_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135590
dc.description.abstractThe thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow characteristic possible. While a cursory review of the thermal network established between heat sources and sinks in typical plate fin heat sinks would indicate that the film resistance at the fluid-solid boundary dominates, it is shown that the effects of other resistance elements, such as the spreading resistance and the material resistance, although of lesser magnitude, play an important role in the optimization and selection of heat sink design conditions. An analytical model is presented for calculating the best possible design parameters for plate fin heat sinks using an entropy generation minimization procedure with constrained variable optimization. The method characterizes the contribution to entropy production of all relevant thermal resistances in the path between source and sink as well as the contribution to viscous dissipation associated with fluid flow at the boundaries of the heat sink. The minimization procedure provides a fast, convenient method for establishing the “best case” design characteristics of plate fin heat sinks given a set of prescribed boundary conditions. It is shown that heat sinks made of composite materials containing nonmetallic constituents, with a thermal conductivity as much as an order of magnitude less that typical metallic heat sinks, can provide an effective alternative where performance, cost, and manufacturability are of importance. It is also shown that the spreading resistance encountered when heat flows from a heat source to the base plate of a heat sink, while significant, can be compensated for by making appropriate design modifications to the heat sink.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThe Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2429713
dc.journal.fristpage76
dc.journal.lastpage81
dc.identifier.eissn1043-7398
dc.keywordsElectrical resistance
dc.keywordsDesign
dc.keywordsHeat sinks
dc.keywordsThermal conductivity AND Optimization
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001
dc.contenttypeFulltext


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