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dc.contributor.authorXianjie Yang
dc.contributor.authorYan Luo
dc.contributor.authorQing Gao
dc.date.accessioned2017-05-09T00:23:27Z
dc.date.available2017-05-09T00:23:27Z
dc.date.copyrightMarch, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26272#41_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135584
dc.description.abstractBased on the time dependent multiaxial deformation behavior of 96.5Sn–3.5Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model, the nonproportionality which affects the back stress evolution rate is introduced. The approach for the determination of model parameters is proposed. The model is used to describe the time-dependent cyclic deformation behavior of 96.5Sn–3.5Ag solder alloy under cross, rectangular, rhombic, and double-triangular tensile–torsion multiaxial strain paths at different strain rates with different dwell time. The comparison between the predicted and experimental results demonstrates that the model can satisfactorily describe the time-dependent multiaxial cyclic deformation behavior under complicated nonproportional cyclic straining.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleConstitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2429708
dc.journal.fristpage41
dc.journal.lastpage47
dc.identifier.eissn1043-7398
dc.keywordsDeformation
dc.keywordsStress
dc.keywordsModeling
dc.keywordsSolders AND Alloys
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001
dc.contenttypeFulltext


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