Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

dc.contributor.author	Juan Gomez
dc.contributor.author	Cemal Basaran
dc.date.accessioned	2017-05-09T00:23:23Z
dc.date.available	2017-05-09T00:23:23Z
dc.date.copyright	June, 2007
dc.date.issued	2007
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26275#120_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/135563
dc.description.abstract	Strain gradient plasticity theories that have emerged during recent years to provide an explanation for size dependent behavior exhibited by some materials have also created a need for additional material parameters. In this study on Pb∕Sn solder alloys’ material length scale, which is needed for use in strain gradient plasticity type constitutive models, is determined. The value of length scale is in agreement with values available in literature for different materials like copper, nickel, and aluminum.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
dc.type	Journal Paper
dc.journal.volume	129
dc.journal.issue	2
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.2721082
dc.journal.fristpage	120
dc.journal.lastpage	128
dc.identifier.eissn	1043-7398
dc.keywords	Alloys
dc.keywords	Solders
dc.keywords	Gradients
dc.keywords	Nanoindentation
dc.keywords	Microelectronic devices
dc.keywords	Plasticity AND Copper
dc.tree	Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 002
dc.contenttype	Fulltext