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dc.contributor.authorSheng-Chung Tzeng
dc.contributor.authorTzer-Ming Jeng
dc.date.accessioned2017-05-09T00:23:23Z
dc.date.available2017-05-09T00:23:23Z
dc.date.copyrightJune, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26275#113_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135562
dc.description.abstractThis work experimentally and numerically investigates the heat transfer in uncompressed∕compressed metal foams. Experiments were conducted to obtain the thermal characteristics of a rectangular channel filled with aluminum foams using air as the fluid medium. The experimental data reveal that the uncompressed sample has a larger Nusselt number (Nu) than the compressed sample. The 0.93 porosity sample has the largest average Nu followed by the 0.7 porosity sample; the 0.8 porosity sample has the worst average Nu. The experimental data concerning the 0.93 porosity samples (uncompressed samples) were consistent with the numerical predictions obtained using the model for high-porosity metal foam, reported elsewhere. Finally, a numerical model to simulate flow and heat transfer characteristics in compressed metal foams is presented and the interstitial heat transfer coefficient and dispersion conductivity were semi-empirically determined.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleInterstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2721081
dc.journal.fristpage113
dc.journal.lastpage119
dc.identifier.eissn1043-7398
dc.keywordsFluids
dc.keywordsFoams (Chemistry)
dc.keywordsAluminum
dc.keywordsComputer simulation
dc.keywordsConductivity
dc.keywordsFlow (Dynamics)
dc.keywordsMetal foams
dc.keywordsPorosity
dc.keywordsHeat transfer coefficients
dc.keywordsEquations
dc.keywordsChannels (Hydraulic engineering)
dc.keywordsHeat sinks AND Heat transfer
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 002
dc.contenttypeFulltext


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