Show simple item record

dc.contributor.authorGang Chen
dc.contributor.authorKwang Soo Kim
dc.contributor.authorMohammad Abdel-Karim
dc.contributor.authorMasao Sakane
dc.contributor.authorXu Chen
dc.date.accessioned2017-05-09T00:23:21Z
dc.date.available2017-05-09T00:23:21Z
dc.date.copyrightSeptember, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26276#278_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135550
dc.description.abstractA series of multiaxial ratcheting tests were conducted on 63Sn–37Pb solder. A unified viscoplastic constitutive model was developed on the basis of the Ohno–Wang kinematic hardening model, and the rate dependence of the material was taken into consideration by introducing a viscous term. The stress-strain hysteresis loop of 63Sn–37Pb under different strain rates can be simulated reasonably well by the model. However, since the axial ratcheting strain rate of 63Sn–37Pb solder is strongly dependent on the applied shear strain rates in axial/torsional ratcheting, the original constitutive model fails to describe the effect of shear strain rate on the ratcheting strain. To improve the rate sensitivity of the model, the material parameter μi was correlated to the strain rate. Comparisons of the experimental and simulated results verify that the modified constitutive model is able to predict the complicated deformation of 63Sn–37Pb. The effects of axial stress, shear strain range, loading history, and strain rate on ratcheting behavior can be reflected fairly well.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleStrain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2753917
dc.journal.fristpage278
dc.journal.lastpage286
dc.identifier.eissn1043-7398
dc.keywordsSolders
dc.keywordsStress
dc.keywordsHardening
dc.keywordsShear (Mechanics)
dc.keywordsConstitutive equations AND Deformation
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
dc.contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record