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dc.contributor.authorFang Liu
dc.contributor.authorGuang Meng
dc.contributor.authorMei Zhao
dc.date.accessioned2017-05-09T00:23:21Z
dc.date.available2017-05-09T00:23:21Z
dc.date.copyrightSeptember, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26276#266_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135548
dc.description.abstractDynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are macromolecule resins, which are typical viscoelastic materials. From the viewpoint of viscoelasticity, the dynamics of PCBs under drop impact is analyzed based on mass-damping-spring, beam, and plate theories. It is demonstrated that the viscoelasticity of a PCB has distinct influences on the dynamic properties of PCBs under board-level drop impact. When there is an increase in the viscosity of substrate materials, the damping coefficients of PCBs would rise, its deflection and acceleration responses could diminish faster, and the maximum deflection of PCBs would become smaller. Meanwhile, with the same viscosity and drop impact conditions, a larger plate would produce a bigger deflection response. Therefore, drop impact reliability could be enhanced by choosing substrate material of larger viscoelasticity and reducing properly the size of PCBs. Dynamic analysis of PCBs under drop impact not only contributes to perfecting theoretical research, but also provides a reference for the choice of substrate materials and reliability design of PCBs when electronic products are devised.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleViscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2753910
dc.journal.fristpage266
dc.journal.lastpage272
dc.identifier.eissn1043-7398
dc.keywordsDynamics (Mechanics)
dc.keywordsViscosity
dc.keywordsDrops
dc.keywordsDamping
dc.keywordsDeflection AND Springs
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
dc.contenttypeFulltext


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