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dc.contributor.authorD. H. Lee
dc.contributor.authorY. S. Chung
dc.contributor.authorP. M. Ligrani
dc.date.accessioned2017-05-09T00:23:20Z
dc.date.available2017-05-09T00:23:20Z
dc.date.copyrightSeptember, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26276#221_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135541
dc.description.abstractFluid flow and heat transfer characteristics on and around a central pedestal and a secondary pedestal, mounted on a flat surface with an impinging jet, are investigated. Surface Nusselt numbers, pressure coefficients (in the form of normalized wall static pressure relative to freestream static pressure), and flow visualization results are given for jet Reynolds numbers of 23,000 and 2300. The dimensionless nozzle-to-surface distance L∕d is 2, and the nondimensional height of the central pedestal H∕D is 0.5. Results are given for different secondary pedestal heights and locations. Spatially averaged Nusselt numbers measured with secondary pedestals employed are 13% to 33% higher than values measured with no secondary pedestal. Local Nusselt numbers and wall pressure coefficients, measured with the secondary pedestal present, are different from values measured with no secondary pedestal, because of flow reattachment and the two counter-rotating recirculation zones located between the two pedestals, and small local regions of flow separation and recirculation located on top of the secondary pedestal. As such, the present multiple pedestal data with impinging jets are useful for a variety of electronics cooling arrangements.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleJet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2753884
dc.journal.fristpage221
dc.journal.lastpage228
dc.identifier.eissn1043-7398
dc.keywordsPressure
dc.keywordsFlow (Dynamics)
dc.keywordsFlow visualization
dc.keywordsNozzles
dc.keywordsFins
dc.keywordsJets
dc.keywordsFlow separation
dc.keywordsImpingement cooling
dc.keywordsTemperature
dc.keywordsFlat plates
dc.keywordsReynolds number AND Heat transfer
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
dc.contenttypeFulltext


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