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dc.contributor.authorTa-Wei Lin
dc.contributor.authorMing-Chang Wu
dc.contributor.authorLi-Kang Liu
dc.contributor.authorChun-Jen Fang
dc.contributor.authorYing-Huei Hung
dc.date.accessioned2017-05-09T00:19:38Z
dc.date.available2017-05-09T00:19:38Z
dc.date.copyrightMarch, 2006
dc.date.issued2006
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26259#82_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/133562
dc.description.abstractA series of experimental investigations on the studies related to transient- and steady-state cooling performance from the horizontally heated heat sinks with a confined slot jet impingement have been conducted. The relevant parameters influencing the transient convective cooling performance include the steady-state Grashof number, ratio of jet separation distance to nozzle width, ratio of heat sink height to nozzle width, and jet Reynolds number. The transient heat transfer behaviors such as the temperature distribution, local and average Nusselt numbers on the heated heat sinks have been systematically explored. Two empirical correlations of steady-state local and average Nusselt numbers are presented. Furthermore, a complete composite correlation of steady-state average Nusselt number for mixed convection due to jet impingement and buoyancy is proposed. This empirical correlation obtained by data regression is in good agreement with the experimental data. The maximum and average regression errors are 7.46% and 2.87%, respectively.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleCooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks
dc.typeJournal Paper
dc.journal.volume128
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2161426
dc.journal.fristpage82
dc.journal.lastpage91
dc.identifier.eissn1043-7398
dc.keywordsNozzles
dc.keywordsHeat sinks
dc.keywordsSteady state
dc.keywordsHeat transfer
dc.keywordsCooling
dc.keywordsReynolds number
dc.keywordsComposite materials
dc.keywordsTemperature distribution AND Heat flux
dc.treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001
dc.contenttypeFulltext


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