Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]

dc.contributor.author	Mudasir Ahmad
dc.contributor.author	Ken Hubbard
dc.contributor.author	Mason Hu
dc.date.accessioned	2017-05-09T00:19:37Z
dc.date.available	2017-05-09T00:19:37Z
dc.date.copyright	March, 2006
dc.date.issued	2006
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26259#98_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/133550
dc.description.abstract	Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]
dc.type	Journal Paper
dc.journal.volume	128
dc.journal.issue	1
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.2165648
dc.journal.fristpage	98
dc.identifier.eissn	1043-7398
dc.keywords	Electronic packaging
dc.keywords	Shapes AND Solder joints
dc.tree	Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001
dc.contenttype	Fulltext