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dc.contributor.authorSteven W. Tillery
dc.contributor.authorSamuel N. Heffington
dc.contributor.authorMarc K. Smith
dc.contributor.authorAri Glezer
dc.date.accessioned2017-05-09T00:19:36Z
dc.date.available2017-05-09T00:19:36Z
dc.date.copyrightJune, 2006
dc.date.issued2006
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26263#145_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/133544
dc.description.abstractIn this paper we describe a new two-phase cooling cell based on channel boiling and a vibration-induced liquid jet whose collective purpose is to delay the onset of critical heat flux by forcibly dislodging the small vapor bubbles that form on the heated surface during nucleate boiling and propelling them into the cooler bulk liquid within the cell. The submerged turbulent vibration-induced jet is generated by a vibrating piezoelectric diaphragm operating at resonance. The piezoelectric driver induces pressure oscillations in the liquid near the surface of the diaphragm, resulting in the time-periodic formation and collapse of cavitation bubbles that entrain surrounding liquid and generate a strong liquid jet. The resultant jet is directed at the heated surface in the channel. The jet enhances boiling heat transfer by removing attached vapor bubbles that insulate the surface and provides additional forced convection heat transfer on the surface. A small cross flow maintained within the cell increases heat transfer even further by sweeping the bubbles downstream, where they condense. In addition, the cross flow keeps the temperature of the liquid within the cell regulated. In the present experiments, the cell dimensions were 51×25×76mm and water was the working liquid. Heat fluxes above 300W∕cm2 were obtained at surface temperatures near 150°C for a horizontal cell.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleBoiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet
dc.typeJournal Paper
dc.journal.volume128
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2188954
dc.journal.fristpage145
dc.journal.lastpage149
dc.identifier.eissn1043-7398
dc.keywordsTemperature
dc.keywordsHeat transfer
dc.keywordsVapors
dc.keywordsBubbles
dc.keywordsBoiling
dc.keywordsVibration
dc.keywordsWater
dc.keywordsDiaphragms (Structural)
dc.keywordsHeat flux
dc.keywordsCooling
dc.keywordsHeat
dc.keywordsFlux (Metallurgy) AND Cross-flow
dc.treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 002
dc.contenttypeFulltext


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