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dc.contributor.authorRodrigo Escobar
dc.contributor.authorBrian Smith
dc.contributor.authorCristina Amon
dc.date.accessioned2017-05-09T00:19:36Z
dc.date.available2017-05-09T00:19:36Z
dc.date.copyrightJune, 2006
dc.date.issued2006
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26263#115_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/133540
dc.description.abstractNumerical simulations of time-dependent energy transport in semiconductor thin films are performed using the lattice Boltzmann method applied to phonon transport. The discrete lattice Boltzmann method is derived from the continuous Boltzmann transport equation assuming first gray dispersion and then nonlinear, frequency-dependent phonon dispersion for acoustic and optical phonons. Results indicate that a transition from diffusive to ballistic energy transport is found as the characteristic length of the system becomes comparable to the phonon mean free path. The methodology is used in representative microelectronics applications covering both crystalline and amorphous materials including silicon thin films and nanoporous silica dielectrics. Size-dependent thermal conductivity values are also computed based on steady-state temperature distributions obtained from the numerical models. For each case, reducing feature size into the subcontinuum regime decreases the thermal conductivity when compared to bulk values. Overall, simulations that consider phonon dispersion yield results more consistent with experimental correlations.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleLattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
dc.typeJournal Paper
dc.journal.volume128
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2188951
dc.journal.fristpage115
dc.journal.lastpage124
dc.identifier.eissn1043-7398
dc.keywordsThin films
dc.keywordsTemperature
dc.keywordsPhonons
dc.keywordsThermal conductivity
dc.keywordsSilicon
dc.keywordsLattice Boltzmann methods
dc.keywordsConductivity
dc.keywordsMicroelectronic devices
dc.keywordsEquations AND Modeling
dc.treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 002
dc.contenttypeFulltext


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