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dc.contributor.authorMinhua Lu
dc.contributor.authorR. J. Bezama
dc.contributor.authorLarry Mok
dc.date.accessioned2017-05-09T00:19:33Z
dc.date.available2017-05-09T00:19:33Z
dc.date.copyrightDecember, 2006
dc.date.issued2006
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26266#427_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/133508
dc.description.abstractA vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80W∕cm2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleA Graphite Foams Based Vapor Chamber for Chip Heat Spreading
dc.typeJournal Paper
dc.journal.volume128
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2351908
dc.journal.fristpage427
dc.journal.lastpage431
dc.identifier.eissn1043-7398
dc.keywordsFluids
dc.keywordsVapors
dc.keywordsGraphite
dc.keywordsEthanol
dc.keywordsFoams (Chemistry)
dc.keywordsThermal conductivity
dc.keywordsHeat flux AND Thermal resistance
dc.treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
dc.contenttypeFulltext


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