Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

dc.contributor.author	A. Polyakov
dc.contributor.author	M. Bartek
dc.contributor.author	J. N. Burghartz
dc.date.accessioned	2017-05-09T00:15:54Z
dc.date.available	2017-05-09T00:15:54Z
dc.date.copyright	March, 2005
dc.date.issued	2005
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26242#7_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/131663
dc.description.abstract	This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5±3.9 J/m2 with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
dc.type	Journal Paper
dc.journal.volume	127
dc.journal.issue	1
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.1846059
dc.journal.fristpage	7
dc.journal.lastpage	11
dc.identifier.eissn	1043-7398
dc.keywords	Adhesives
dc.keywords	Bonding
dc.keywords	Semiconductor wafers
dc.keywords	Fracture toughness
dc.keywords	Wedges AND Tensile strength
dc.tree	Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001
dc.contenttype	Fulltext