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dc.contributor.authorM. Dube
dc.contributor.authorT. Kundu
dc.date.accessioned2017-05-09T00:15:53Z
dc.date.available2017-05-09T00:15:53Z
dc.date.copyrightJune, 2005
dc.date.issued2005
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26243#147_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/131654
dc.description.abstractField reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (, 2001, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic Pb∕Sn data of (, , and , 2001, “Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging,” report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleYield Function for Solder Elastoviscoplastic Modeling
dc.typeJournal Paper
dc.journal.volume127
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.1869514
dc.journal.fristpage147
dc.journal.lastpage156
dc.identifier.eissn1043-7398
dc.keywordsTemperature
dc.keywordsSolders
dc.keywordsModeling AND Stress
dc.treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002
dc.contenttypeFulltext


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