3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

dc.contributor.author	John H. Lau
dc.contributor.author	Stephen H. Pan
dc.date.accessioned	2017-05-09T00:09:49Z
dc.date.available	2017-05-09T00:09:49Z
dc.date.copyright	December, 2003
dc.date.issued	2003
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26225#621_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/128161
dc.description.abstract	In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous chemical reaction of the Sn layer and the Sn5Cu6 layer. The Sn layer is assumed to be an elasto-plastic material. The results presented herein is useful in understanding why the compressive stress in the Sn layer can initiate a tin whisker near the weak spot of a SnOx layer.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
dc.type	Journal Paper
dc.journal.volume	125
dc.journal.issue	4
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.1604805
dc.journal.fristpage	621
dc.journal.lastpage	624
dc.identifier.eissn	1043-7398
dc.keywords	Copper
dc.keywords	Stress
dc.keywords	Stress analysis (Engineering)
dc.keywords	Compressive stress AND Boundary-value problems
dc.tree	Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004
dc.contenttype	Fulltext