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dc.contributor.authorA. M. Anderson
dc.date.accessioned2017-05-08T23:53:14Z
dc.date.available2017-05-08T23:53:14Z
dc.date.copyrightMarch, 1997
dc.date.issued1997
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26158#32_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/118551
dc.description.abstractThis paper summarizes computational results for flow and heat transfer over an array ofidealized electronic components and compares them to experimental data. The numerical modeling was performed using a commercial finite control volume computer code (Flotherm1 , by Flomerics) and the results are compared to a set of experimental data. The experimental model consists of a uniform array of eight rows by six columns of solid aluminum blocks (9.5 mm high × 46.5 mm wide × 37.5 mm long) mounted on an adiabatic wall of a channel in forced convection flow. Four channel heights (H/B = 1.5–4.6) and a range of inlet velocities (3.0 to 8.1 m/s) were modelled. The flow was modeled as turbulent flow using the κ-ε turbulence model. Data for the adiabatic heat transfer coefficient had , the superposition kernel function g*, and the channel pressure drop ΔP are compared. The computational results for had are in excellent agreement with the experimental data (within about five percent on average). The computationalresults for g* predict the correct trends (roll off with downstream distance, channel height dependence, and velocity independence). However, values are as much as 50 percent higher than the experimental results which means the computational model under-predicts the amount of cross channel mixing. Computational results for ΔP compare reasonably well (within 20 percent on average).
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleA Comparison of Computational and Experimental Results for Flow and Heat Transfer From an Array of Heated Blocks
dc.typeJournal Paper
dc.journal.volume119
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2792198
dc.journal.fristpage32
dc.journal.lastpage39
dc.identifier.eissn1043-7398
dc.keywordsFlow (Dynamics) AND Heat transfer
dc.treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001
dc.contenttypeFulltext


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