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dc.contributor.authorG. P. Peterson
dc.date.accessioned2017-05-08T23:37:17Z
dc.date.available2017-05-08T23:37:17Z
dc.date.copyrightMay, 1992
dc.date.issued1992
dc.identifier.issn0003-6900
dc.identifier.otherAMREAD-25626#175_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/109572
dc.description.abstractThe concept of a micro heat pipe was first proposed in 1984. Since that time, numerous analytical and experimental investigations have been conducted to determine the fundamental parameters that govern the operation of these devices. Micro heat pipes ranging in size from 1 mm in diameter and 60 mm in length to 30 μm in diameter and 10 mm in length have been analyzed, modelled, and fabricated. The following review describes the historical development of these devices, along with the analytical and numerical techniques used to model and predict their performance and the results of several recent experimental investigations. Because of recent advances in the development of micro heat pipes fabricated as an integral part of semiconductor wafers, particular emphasis has been placed on various construction and charging methods currently under investigation.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleOverview of Micro Heat Pipe Research and Development
dc.typeJournal Paper
dc.journal.volume45
dc.journal.issue5
dc.journal.titleApplied Mechanics Reviews
dc.identifier.doi10.1115/1.3119755
dc.journal.fristpage175
dc.journal.lastpage189
dc.identifier.eissn0003-6900
dc.keywordsIndustrial research
dc.keywordsHeat pipes
dc.keywordsSemiconductor wafers AND Construction
dc.treeApplied Mechanics Reviews:;1992:;volume( 045 ):;issue: 005
dc.contenttypeFulltext


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