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dc.contributor.authorK. L. De Weese
dc.contributor.authorC. K. H. Dharan
dc.contributor.authorC. E. Toups
dc.date.accessioned2017-05-08T23:29:46Z
dc.date.available2017-05-08T23:29:46Z
dc.date.copyrightMarch, 1989
dc.date.issued1989
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26106#21_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/105269
dc.description.abstractSignificant stresses are induced in brazed metal-to-ceramic joints during cool-down. Analysis of such stresses is complicated by nonlinear material behavior and uncertainties in material properties at and near the braze temperatures. In this study, stresses induced during cool-down from the brazing temperature are analytically determined for a coaxial RF (radio frequency) window, which is an integral component of many traveling-wave tube (TWT) devices. The approach is to use nonlinear finite element analysis which takes into account plastic deformation of the metal components as well as the temperature dependence of material properties. Details of the modeling techniques, analytical assumptions and boundary conditions employed are discussed. In addition, metallographic analysis of the brazed test assemblies is described. Analytically predicted stress distributions showed reasonably good correlation with both the location and direction of cracks observed in the ceramic component of brazed sample test assemblies. The results of this investigation emphasize the need for accurate material properties for the braze alloys used in such joints, including temperature dependence, as well as an understanding of their nonlinear behavior, for the stress analysis model to be accurate. In addition, the important role of joint geometry in the minimization of cool-down stresses in brazed metal-ceramic assemblies is described.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAnalysis of Brazing Stresses in Ceramic-Metal Joints in High-Vacuum Devices
dc.typeJournal Paper
dc.journal.volume111
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3226503
dc.journal.fristpage21
dc.journal.lastpage25
dc.identifier.eissn1043-7398
dc.keywordsCeramics
dc.keywordsVacuum
dc.keywordsStress
dc.keywordsBrazing
dc.keywordsMetals
dc.keywordsTemperature
dc.keywordsMaterials properties
dc.keywordsFinite element analysis
dc.keywordsModeling
dc.keywordsBoundary-value problems
dc.keywordsGeometry
dc.keywordsTravel
dc.keywordsDeformation
dc.keywordsAlloys
dc.keywordsMetalwork
dc.keywordsIndustrial ceramics
dc.keywordsWaves
dc.keywordsStress analysis (Engineering) AND Fracture (Materials)
dc.treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001
dc.contenttypeFulltext


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