| dc.contributor.author | J. H. Lau | |
| dc.date.accessioned | 2017-05-08T23:29:45Z | |
| dc.date.available | 2017-05-08T23:29:45Z | |
| dc.date.copyright | March, 1989 | |
| dc.date.issued | 1989 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26106#2_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/105265 | |
| dc.description.abstract | An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed stress and strain distributions and whole-field displacements of the assembly are also provided for a better understanding of its mechanical behavior during thermal cycling. It was found that the stresses and strains in the PQFP solder joint are smaller than those in the plastic-leaded-chip-carrier (PLCC) solder joint. The results presented herein should be useful in the design for reliability of this class of surface mount assemblies. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Thermal Stress Analysis of SMT PQFP Packages and Interconnections | |
| dc.type | Journal Paper | |
| dc.journal.volume | 111 | |
| dc.journal.issue | 1 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.3226505 | |
| dc.journal.fristpage | 2 | |
| dc.journal.lastpage | 8 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Thermal stresses | |
| dc.keywords | Manufacturing | |
| dc.keywords | Solder joints | |
| dc.keywords | Stress | |
| dc.keywords | Surface mount assemblies | |
| dc.keywords | Reliability | |
| dc.keywords | Finite element methods | |
| dc.keywords | Design AND Mechanical behavior | |
| dc.tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001 | |
| dc.contenttype | Fulltext | |
