Component Placement for Reliability on Conductively Cooled Printed Wiring Boards

dc.contributor.author	M. D. Osterman
dc.contributor.author	M. Pecht
dc.date.accessioned	2017-05-08T23:29:45Z
dc.date.available	2017-05-08T23:29:45Z
dc.date.copyright	June, 1989
dc.date.issued	1989
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26108#149_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/105263
dc.description.abstract	With the increased demand for highly reliable electronic equipment and limitations that make improvements to the reliability of individual components difficult to obtain, methods to improve the reliability at higher levels of packaging are being sought. This article presents the mathematical theory for improving reliability by appropriately locating components on conductively cooled printed wiring boards based on the thermal behavior of the components on the board. Placement techniques are then constructed to minimize the total failure rate of the collection of components.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Component Placement for Reliability on Conductively Cooled Printed Wiring Boards
dc.type	Journal Paper
dc.journal.volume	111
dc.journal.issue	2
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.3226521
dc.journal.fristpage	149
dc.journal.lastpage	156
dc.identifier.eissn	1043-7398
dc.keywords	Reliability
dc.keywords	Printed circuit boards
dc.keywords	Packaging
dc.keywords	Electronic equipment AND Failure
dc.tree	Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
dc.contenttype	Fulltext