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dc.contributor.authorD. B. Wallace
dc.date.accessioned2017-05-08T23:29:45Z
dc.date.available2017-05-08T23:29:45Z
dc.date.copyrightJune, 1989
dc.date.issued1989
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26108#108_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/105257
dc.description.abstractThe feasibility of using ink-jet technology to write circuits on PC board material and TAB substrate has been demonstrated. Several systems were evaluated and the most successful system used paraffin as a resist material on a copper substrate. The copper was etched and the paraffin subsequently removed to form the conductive paths of the circuit. Line widths down to 100μm were achieved, and line widths of 50μm were shown feasible. The generation of the print pattern from a computer file illustrated the potential of coupling a circuit writing system to an electrical CAD system to provide rapid turnaround prototype circuits.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAutomated Electronic Circuit Manufacturing Using Ink-Jet Technology
dc.typeJournal Paper
dc.journal.volume111
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.3226514
dc.journal.fristpage108
dc.journal.lastpage111
dc.identifier.eissn1043-7398
dc.keywordsInks
dc.keywordsManufacturing
dc.keywordsCircuits
dc.keywordsCopper
dc.keywordsParaffin wax
dc.keywordsEngineering prototypes
dc.keywordsComputer-aided design AND Computers
dc.treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
dc.contenttypeFulltext


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