Ceramic Materials for Electronic Packaging

dc.contributor.author	E. M. Rabinovich
dc.date.accessioned	2017-05-08T23:29:43Z
dc.date.available	2017-05-08T23:29:43Z
dc.date.copyright	September, 1989
dc.date.issued	1989
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26110#183_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/105240
dc.description.abstract	The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Ceramic Materials for Electronic Packaging
dc.type	Journal Paper
dc.journal.volume	111
dc.journal.issue	3
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.3226532
dc.journal.fristpage	183
dc.journal.lastpage	191
dc.identifier.eissn	1043-7398
dc.keywords	Ceramics
dc.keywords	Electronic packaging
dc.keywords	Glass ceramics
dc.keywords	Firing (materials)
dc.keywords	Sol-gel processing AND Packaging
dc.tree	Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003
dc.contenttype	Fulltext