Twist-Off Testing of Solder Joint Interconnections

Abstract

Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we briefly discuss the merits and shortcomings of both techniques and determine the relationship between the ultimate torque and the ultimate shearing force. We also suggest a simple experimental method for the evaluation of the shearing strength of solder joints on the basis of twist-off testing. It should be emphasized that such testing can be used not only for a tentative comparative evaluation of different interconnections but as a quality control vehicle as well.