| dc.contributor.author | J. W. Eischen | |
| dc.contributor.author | J. S. Everett | |
| dc.date.accessioned | 2017-05-08T23:29:40Z | |
| dc.date.available | 2017-05-08T23:29:40Z | |
| dc.date.copyright | December, 1989 | |
| dc.date.issued | 1989 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26113#282_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/105227 | |
| dc.description.abstract | Formulas are derived for the stresses and displacements in a bimaterial strip which is subjected to a temperature gradient that varies linearly in the longitudinal direction. The solution is obtained by superposing certain fundamental linear elastic stress states which are compatible with bar and beam theory. The analytical results are approximate in the sense that stress-free boundary conditions are not satisfied exactly, since only zero resultant force and moment conditions are enforced. Finite element calculations have been performed to verify the results and to ascertain the level of stress concentration near the ends of the strip. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Thermal Stress Analysis of a Bimaterial Strip Subject to an Axial Temperature Gradient | |
| dc.type | Journal Paper | |
| dc.journal.volume | 111 | |
| dc.journal.issue | 4 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.3226548 | |
| dc.journal.fristpage | 282 | |
| dc.journal.lastpage | 288 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Thermal stresses | |
| dc.keywords | Strips | |
| dc.keywords | Temperature gradients | |
| dc.keywords | Stress | |
| dc.keywords | Force | |
| dc.keywords | Stress concentration | |
| dc.keywords | Finite element analysis | |
| dc.keywords | Boundary-value problems AND Formulas | |
| dc.tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004 | |
| dc.contenttype | Fulltext | |