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contributor authorWen-Jun Liang
contributor authorGuo-Bin Yin
contributor authorXiu-Juan Shi
contributor authorJia Liu
contributor authorFeng Bin
date accessioned2023-08-16T19:20:54Z
date available2023-08-16T19:20:54Z
date issued2023/04/01
identifier otherJOEEDU.EEENG-7179.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4293130
description abstractNonthermal plasma (NTP) is a promising technology for the decomposition of chlorobenzene (CB), but many conditions will affect the performance of NTP. The effects of gas temperature, relative humidity, oxygen content, sulfur dioxide (SO2), and nitric oxide (NO) on the removal of CB in dielectric barrier discharge (DBD) were studied in this study. The results showed that the gas temperature with the highest CB removal rate was 50°C at 14 kV and 200°C at 18 kV. With the addition of water vapor, the removal efficiency of CB first increased and then decreased, reaching the highest (52.94%) when the relative humidity was 20% at 14 kV. The presence of oxygen inhibited the degradation of CB. At 14 kV, when the oxygen concentration increased from 0% to 25%, the degradation efficiency of CB decreased from 71.93% to 32.54%. In the discharge process, the addition of SO2 promoted the removal of CB, while NO inhibited under the same conditions. The addition of SO2 and NO did not change the specific energy density. For ozone (O3), the addition of water molecules, SO2, and NO inhibited the formation of O3. It is of great significance to study the influence of relevant gas conditions on the degradation of CB by NTP technology, so as to provide a reference for industrial application.
publisherAmerican Society of Civil Engineers
titlePerformance of the Chlorobenzene Destruction with Nonthermal Plasma: Effects of the Gas Conditions and the Gas Components
typeJournal Article
journal volume149
journal issue4
journal titleJournal of Environmental Engineering
identifier doi10.1061/JOEEDU.EEENG-7179
journal fristpage04023009-1
journal lastpage04023009-16
page16
treeJournal of Environmental Engineering:;2023:;Volume ( 149 ):;issue: 004
contenttypeFulltext


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