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Modeling of Two Phase Evaporative Heat Transfer in Three Dimensional Multicavity High Performance Microprocessor Chip Stacks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) stacking of integratedcircuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with areaarray throughsiliconvias (TSVs). This reduces the length ...
Calculation of Nuclear Reactor Cooling Tower Performance With Limited Data Streams
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Monitoring of cooling tower performance in a nuclear reactor facility is necessary to ensure safe operation; however, instrumentation for measuring performance characteristics can be difficult to install and may malfunction ...
Calculation of Nuclear Reactor Cooling Tower Performance With Limited Data Streams
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Monitoring of cooling tower performance in a nuclear reactor facility is necessary to ensure safe operation; however, instrumentation for measuring performance characteristics can be difficult to install and may malfunction ...