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    Modeling of Two Phase Evaporative Heat Transfer in Three Dimensional Multicavity High Performance Microprocessor Chip Stacks 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002:;page 21006
    Author(s): Madhour, Yassir; d'Entremont, Brian P.; Braz Marcinichen, Jackson; Michel, Bruno; Richard Thome, John
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Threedimensional (3D) stacking of integratedcircuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with areaarray throughsiliconvias (TSVs). This reduces the length ...
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    Calculation of Nuclear Reactor Cooling Tower Performance With Limited Data Streams 

    Source: Journal of Thermal Science and Engineering Applications:;2022:;volume( 015 ):;issue: 001:;page 11013
    Author(s): Katinas, Christopher;Reichardt, Thomas;d’Entremont, Brian;Ray, William;Willis, Michael;Kulp, Thomas
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Monitoring of cooling tower performance in a nuclear reactor facility is necessary to ensure safe operation; however, instrumentation for measuring performance characteristics can be difficult to install and may malfunction ...
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    Calculation of Nuclear Reactor Cooling Tower Performance With Limited Data Streams 

    Source: Journal of Thermal Science and Engineering Applications:;2022:;volume( 015 ):;issue: 001:;page 11013-1
    Author(s): Katinas, Christopher; Reichardt, Thomas; d’Entremont, Brian; Ray, William; Willis, Michael; Kulp, Thomas
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Monitoring of cooling tower performance in a nuclear reactor facility is necessary to ensure safe operation; however, instrumentation for measuring performance characteristics can be difficult to install and may malfunction ...
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